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Embedded World 2025
Nuremberg, Germany, 11 March 2025
We are excited to attend this week the Embedded World exhibition, where we will be presenting a collaborative IoT RSP solution (SGP.32) with Semtech and Sony Semicon. This solution features the latest LPWA HL7900 Semtech module integrated with Newtone Labs IPA and eIM technology.
We cordially invite you to visit us at the Semtech booth to learn more about this cutting-edge development.
We are excited to attend this week the Embedded World exhibition, where we will be presenting a collaborative IoT RSP solution (SGP.32) with Semtech and Sony Semicon. This solution features the latest LPWA HL7900 Semtech module integrated with Newtone Labs IPA and eIM technology.
We cordially invite you to visit us at the Semtech booth to learn more about this cutting-edge development.